In situ ultrasonic stress microsensor for second bond characterization

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 338-343

  Schwizer, Jürg ^a   Mayer, Michael ^a   Brand, Oliver ^a   Baltes, Henry ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Deformation; Piezoresistive microsensor; Second bond; Wedge bond; Wire bonding

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; DEFORMATION; ELECTRIC WIRE; HARMONIC ANALYSIS; PIEZOELECTRIC DEVICES; RELIABILITY; STRENGTHENING (METAL); STRESSES; SUBSTRATES; THERMAL EFFECTS; ULTRASONIC EFFECTS; VIBRATIONS (MECHANICAL);

PIEZORESISTIVE MICROSENSORS; ULTRASONIC STRESSES;

MICROSENSORS;

EID: 0035768411     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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