Mechanical properties of Sn-Ag composite solder joints containing copper-based intermetallics

TMS Annual Meeting

Volumn , Issue , 1997, Pages 241-245

  Choi, S L ^a   Gibson, A W ^a   McDougall, J L ^a   Bieler, T R ^a   Subramanian, K N ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CREEP TESTING; FRACTURE; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; STRAIN RATE; STRENGTH OF MATERIALS; STRESS ANALYSIS; TIN ALLOYS;

LEAD FREE SOLDERS; STEADY STATE CREEP STRAIN;

SOLDERED JOINTS;

EID: 0031336902     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)