Preparation of a chemically amplified photosensitive polyimide based on norbornene-end-capped poly(amic acid ethoxymethylester)

Journal of Polymer Science, Part A: Polymer Chemistry

Volumn 43, Issue 22, 2005, Pages 5520-5528

  Jung, Myung Sup ^a,b   Lee, Sang Kyun ^a   Hyeon Lee, Jinkyu ^a   Park, Moon Ki ^c   Jung, Hee Tae ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c Daegu Haany University   (South Korea)

Author keywords

Lithography; Photoresists; Polyimides; Telechelics

Indexed keywords

AMMONIUM COMPOUNDS; COATING TECHNIQUES; LITHOGRAPHY; PHOTORESISTS; PHOTOSENSITIVITY; SEMICONDUCTOR MATERIALS; THICK FILMS;

POLY(AMIC ACID ETHOXYMETHYLESTER) (PAAE); POLYIMIDE PRECURSOR; TELECHELICS;

POLYIMIDES;

EID: 30544434341     PISSN: 0887624X     EISSN: 10990518     Source Type: Journal    
DOI: 10.1002/pola.21040     Document Type: Article

References (30)

1. Ghosh, M. K.; Mittal, K. L. Polyimides: Fundamentals and Applications; Marcel Dekker: New York, 1996.
2. Horie, K.; Yamashita, T. Photosensitive Polyimides, Fundamentals and Applications; Technomic: Lancaster, PA, 1995.
3. Isobe, A.; Shinohara, M. J Photopolym Sci Technol 1996, 9, 315-322.
4. Makita, A.; Kudo, H.; Nishikubo, T. J Polym Sci Part A: Polym Chem 2004, 42, 3697-3707.
5. Chen, H.; Yin, J. J Polym Sci Part A: Polym Chem 2003, 41, 2026-2035.
6. Chen, H.; Yin, J. J Polym Sci Part A: Polym Chem 2004, 42, 1735-1744.
7. Ahne, H.; Leuschner, R.; Rubner, R. Polym Adv Technol 1993, 4, 217-233.
8. Hsu, S. L.-C.; Chen, H.-T.; Tsai, S.-T. J Polym Sci Part A: Polym Chem 2004, 42, 5990-5998.
9. Seino, H.; Mochizuki, A.; Haba, O.; Ueda, M. J Polym Sci Part A: Polym Chem 1998, 36, 2261-2267.
10. Haba, O.; Okazaki, M.; Nakayama, T.; Ueda, M. J Photopolym Sci Technol 1997, 10, 55-60.
11. Hsu, S. L.-C.; Lee, P.-I.; King, J.-S.; Jeng, J.-L. J Appl Polym Sci 2002, 86, 352-358.
12. Omote, T.; Yamaoka, T. Polym Eng Sci 1992, 32, 1634-1641.
13. Miyagawa, T.; Fukushima, T.; Oyama, T.; Iijima, T.; Tomoi, M. J Polym Sci Part A: Polym Chem 2003, 41, 861-871.
14. Omote, T.; Mochizuki, H.; Koseki, K.; Yamaoka, T. Macromolecules 1990, 23, 4796-4802.
15. Hsu, S. L. C.; Lee, P.-I.; King, J.-S.; Jeng, J.-L. J Appl Polym Sci 2003, 90, 2293-2300.
16. Watanabe, Y.; Shibasaki, Y.; Ando, S.; Ueda, M. Chem Mater 2002, 14, 1762-1766.
17. Ho, B. C.; Chen, J. H.; Perng, W. C.; Lin, C. L.; Chen, L. M. J Appl Polym Sci 1998, 67, 1313-1318.
18. Omote, T.; Koseki, K.; Yamaoka, T. Macromolecules 1990, 23, 4788-4795.
19. Prack, E.; Tran, Z.; Franklin, C.; Tanner, S.; Murray, D. o. Adv Electron Packaging 1997, 1, 1141-1144.
20. Flack, W. W.; Flores, G. E.; Christensen, L.; Newman, G. Proc SPIE 1996, 2726, 169-185.
21. Culver, R. Solid State Technol 1997, Nov., 151-154.
22. Ree, M. H.; Nunes, T. L.; Chen, K. J. R. J Polym Sci Part B: Polym Phys 1995, 33, 453-465.
23. Yang, S. Y.; Park, C. E.; Jung, M. S. Polymer 2003, 44, 3243-3249.
24. Jung, M. S.; Seo, S. J. (Samsung Electronics Co.). U.S. Patent 6,541,178, April 1, 2003.
25. Reichmanis, E.; Houlihan, F. M.; Nalamasu, O.; Neeman, T. X. Chem Mater 1991, 3, 394-407.
26. Cameron, J. F.; Ablaza, S. L.; Xu, G.; Yueh, W. J Photopolym Sci Technol 1999, 12, 607-620.
27. Asano, M.; Tomikawa, M. J Photopolym Sci Technol 1996, 9, 305-308.
28. Coburn, J. C.; Pottiger, M. T. In Polyimides, Fundamentals and Applications; Ghosh, M. K.; Mittal, K. L., Eds.; Marcel Dekker: New York, 1996; Chapter 8, p 239.
29. Hong, C. S.; Jikei, M.; Kikuchi, R.; Kakimoto, M. Macromolecules 2003, 36, 3174-3179.
30. Seino, H.; Mochizuki, A.; Haba, O.; Ueda, M. J Polym Sci Part A: Polym Chem 1998, 36, 2261-2267.