Fabrication of thick silicon dioxide layers for thermal isolation

Journal of Micromechanics and Microengineering

Volumn 14, Issue 6, 2004, Pages 769-774

  Zhang, Chunbo ^a   Najafi, Khalil ^a  

^a The Department of Civil and Environmental Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; DIFFUSION; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; OXIDATION; REACTIVE ION ETCHING; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

DEEP REACTIVE ION ETCHING (DRIE); MICORPACKAGING; THERMAL EXPANSION COEFFICIENT; THERMAL ISOLATION;

SILICA;

EID: 3042544791     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/6/002     Document Type: Article

References (19)

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