Microstructure release and test techniques for high-temperature micro hotplate

Canadian Conference on Electrical and Computer Engineering

Volumn 3, Issue , 1999, Pages 1610-1615

  Grudin, O ^a   Marinescu, R ^a   Landsberger, L ^a   Cheeke, D ^a   Kahrizi, M ^a  

^a Gina Cody School of Engineering and Computer Science   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ETCHING; HIGH TEMPERATURE OPERATIONS; INTEGRATED CIRCUIT MANUFACTURE; MICROSTRUCTURE; TEMPERATURE CONTROL; THERMISTORS; THERMODYNAMIC PROPERTIES;

CMOS TECHNOLOGY; ELECTROTHERMAL PROPERTIES; HIGH TEMPERATURE MICRO HOTPLATE; POLYSILICON; THERMAL ISOLATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0033316434     PISSN: 08407789     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)