Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing

International Journal of Machine Tools and Manufacture

Volumn 46, Issue 5, 2006, Pages 531-541

  Bhagavat, Sumeet ^a   Kao, Imin ^a  

^a STONY BROOK UNIVERSITY   (United States)

Author keywords

Cleavage anisotropy; Crystal anisotropy; Silicon wafer; Wafer production; Wiresaw

Indexed keywords

ANISOTROPY; CRYSTALS; ELECTRIC WIRE; FITS AND TOLERANCES; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

CLEAVAGE ANISOTROPY; CRYSTAL ANISOTROPY; WAFER PRODUCTION; WIRESAW;

SAWING;

EID: 30344479190     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2005.07.003     Document Type: Article

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