Prediction of warping in silicon wafer slicing with wire-saw machine

Theoretical and Applied Mechanics Japan

Volumn 51, Issue , 2002, Pages 251-258

  Yamada, Toshiro ^a   Fukunaga, Moritaka ^a   Ichikawa, Takeshi ^a   Furuno, Kazuhiro ^b   Makino, Kunio ^c   Yokoyama, Atsushi ^d  

^a KANAZAWA UNIVERSITY   (Japan)

^b Keihin Sokki Co Ltd   (Japan)

^c Nippei Toyama Corporation   (Japan)

^d KYOTO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; PROBLEM SOLVING; SILICON WAFERS; SINGLE CRYSTALS; STIFFNESS;

SILICON WAFER SLICING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036909997     PISSN: 13480693     EISSN: 13494244     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Fujisawa, M., "Wire Sawing Technology", JSPE, 60-2 (1994), pp. 182-187.
2. Bhagavat, M., Prasad V., and Kao, I., "Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis", Transactions of the ASME, Journal of Tribology, 22 (2000), pp. 394-404
3. Wei, S. and Kao, I., "Vibration Analysis of Wire and Frequency Response in the Modern Wiresaw Manufacturing Process", Journal of Sound and Vibration, 231-5 (2000), pp. 1383-1395.
4. Oishi, H., Asakawa, K., Tsukamoto, K., and Uno, Y., "Effect of Wire Running Speed and Work Feed Rate on Multiwire Saw Slicing - Study on 400mm-Diameter Silicon Ingot Slicing (3rd report)", JSPE, 67-5 (2001), pp. 791-796.
5. Sakamoto, S., Obata, F., Tanaka, H., Noto, N., and Akita, N., "Fundamental Study on Work Rotating Type Multi-Wire Sawing - Principle of Apparatus and Fundamental Experiments -", JSPE, 66-12 (2000), pp. 1948-1952.
6. Sakamoto, S., Obata, F., Tanaka, H., Noto, N., and Akita, N., "A Study on Slicing Performance of Work Rotating Type Multi-Wire Saw - In Case of Using High Viscosity Slurry -", JSPE, 67-1 (2001), pp. 147-151.
7. Ohbuchi, Y. and Obikawa, T., "FEM Simulation of Abrasive Grain Machining Process - Cutting States with Negative Rake Face -", JSPE, 66-9 (2000), pp. 1467-1471.
8. Ishikawa, K., Suwabe, H., Uneda, M., Matsukawa, T., and Kitajima, A., "Effect of Slurry on Slicing Characteristics of Multi-Wire Saw", JSPE, 66-10 (2000), pp. 1631-1635.
9. ASTM Standard F1390