Galerkin-based modal analysis on the vibration of wire-slurry system in wafer slicing using a wiresaw

Journal of Sound and Vibration

Volumn 283, Issue 3-5, 2005, Pages 589-620

  Zhu, Liqun ^a   Kao, Imin ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EIGENVALUES AND EIGENFUNCTIONS; FINITE ELEMENT METHOD; INGOTS; MODAL ANALYSIS; NONLINEAR EQUATIONS; SAWS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE ROUGHNESS; SURFACE TREATMENT;

GOVERNING EQUATIONS; WAFER SLICING; WIRE-SLURRY SYSTEMS; WIRESAWS;

VIBRATIONS (MECHANICAL);

EID: 15944387989     PISSN: 0022460X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jsv.2004.04.018     Document Type: Article

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