Computational model for Free Abrasive Machining of brittle silicon using a wiresaw

American Society of Mechanical Engineers, Design Engineering Division (Publication) DE

Volumn 104, Issue , 1999, Pages 21-30

  Bhagavat, Milind ^a   Kao, Imin ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; BRITTLENESS; COMPUTATIONAL METHODS; ELASTOHYDRODYNAMICS; FINITE ELEMENT METHOD; MACHINING; MATHEMATICAL MODELS;

FREE ABRASIVE MACHINING; HYDRODYNAMIC SHEAR; WIRESAW SLICING;

SILICON WAFERS;

EID: 0033297156     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

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