Finite element analysis for grinding of wire-sawn silicon wafers: A designed experiment

International Journal of Machine Tools and Manufacture

Volumn 43, Issue 1, 2003, Pages 7-16

  Pei, Z J ^a   Xin, X J ^b   Liu, W ^a  

^a KANSAS STATE UNIVERSITY   (United States)

^b Sunflower Networking Group   (United States)

Author keywords

Design of experiment; Factorial design; Finite element analysis; Grinding; Lapping; Machining; Material removal; Semiconductor material; Silicon wafers; Slicing

Indexed keywords

FINITE ELEMENT METHOD; GRINDING (COMMINUTION); MACHINING; SEMICONDUCTOR MATERIALS;

WIRE-SAWN SILICON WAFERS;

SILICON WAFERS;

EID: 0037210538     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(02)00167-0     Document Type: Article

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