Towards an integrated approach for analysis and design of wafer slicing by a wire saw

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 35-40

  Sahoo, R K ^a   Prasad, V ^a   Kao, I ^a   Talbott, J ^b   Gupta, K P ^b  

^a Stony Brook University   (United States)

^b GT Solar Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; FEEDBACK CONTROL; FINITE ELEMENT METHOD; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS;

WIRE SAW CUTTING;

SILICON WAFERS;

EID: 0032024951     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792283     Document Type: Article

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