Metallurgical Reaction of the Sn-3.5Ag Solder and Sn-37Pb Solder with Ni/ Cu Under-Bump Metallization in a Flip-Chip Package

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1509-1514

  Huang, Chien Sheng ^a   Duh, Jenq Gong ^a   Chen, Yen Ming ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Diffusion; Intermetallic compound; Phase transformation; Sn Ag solder; Under bump metallization

Indexed keywords

COPPER; DIFFUSION; FLIP CHIP DEVICES; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; MICROSTRUCTURE; MORPHOLOGY; MULTILAYERS; PHASE TRANSITIONS; SILVER; TIN;

SN-AG SOLDER; UNDER-BUMP METALLIZATION;

SOLDERING ALLOYS;

EID: 0942266958     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0122-2     Document Type: Conference Paper

References (18)

1. K.S. Bae and S.J. Kim, J. Mater. Res. 17, 743 (2002).
2. H.W. Miao and J.G. Duh, Mater. Chem. Phys. 71, 255 (2001).
3. D.R. Frear, J.W. Jang, J.K. Lin, and C. Zang, JOM 53, 28 (2001).
4. B.L. Young, J.G. Duh, and B.S. Chiou, J. Electron. Mater. 30, 543 (2001).
5. M. McCormack, S. Jin, G.W. Kammlott, and H.S. Chen, Appl. Phys. Lett. 63, 15 (1993).
6. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996).
7. G.R. Blackwell, The Electronic Packaging Handbook (Boca Raton, FL: CRC Press, 2000), pp. 4.4-4.25.
8. A.A. Liu, H.K. Kim, K.N. Tu, and P.A. Totta, J. Appl. Phys. 80, 2774 (1996).
9. D.R. Frear, F.M. Hosking, and P.T. Vianco, Proc. Materials Developments in Microelectronic Packaging Conf. (Materials Park, OH: ASM International, 1991), pp. 229-240.
10. R.G. Werner, D.R. Frear, J. DeRosa, and E. Sorongon, 1999 Int. Symp. on Advanced Packaging Materials (Piscataway, NJ: IEEE, 1999), pp. 246-251.
11. C.S. Huang, J.G. Duh, Y.M. Chen, and J.H. Wang, J. Electron. Mater. 32, 89 (2003).
12. C.S. Huang and J.G. Duh, J. Mater. Res. 18, 935 (2003).
13. J.Y. Park, C.W. Yang, J.S. Ha, C.U. Kim, E.J. Kwon, S.B. Jung, and C.S. Kang, J. Electron. Mater. 30, 3165 (2001).
14. W.K. Choi and H.M. Lee, J. Electron. Mater. 28, 1251 (1999).
15. J.I. Goldstein, Scanning Electron Microscopy and X-ray Microanalysis (New York: Plenum Press, 1992), pp. 306-330.
16. W.H. Tao, C. Chen, C.E. Ho, W.T. Chen, and C.R. Kao, Chem. Mater. 13, 1051 (2001).
17. W.K. Choi, S.Y. Jang, J.H. Kim, K.W. Paik, and H.M. Lee, J. Mater. Res. 17, 597 (2002).
18. M. Li, F. Zhang, W.T. Chen, K. Zeng, K.N. Tu, H. Balkan, and P. Elenius, J. Mater. Res. 17, 1612 (2002).