Optical properties and microstructure of plasma deposited Ta 2O5 and Nb2O5 films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 23, Issue 2, 2005, Pages 241-247

  Szymanowski, H ^a,b   Zabeida, O ^a   Klemberg Sapieha, J E ^a   Martinu, L ^a  

^a ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

^b LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ELLIPSOMETRY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROSTRUCTURE; NIOBIUM COMPOUNDS; OPTICAL PROPERTIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REFRACTIVE INDEX; SPECTROPHOTOMETRY; THIN FILMS;

ENVIRONMENTAL STABILITY; OPTICAL CONSTANTS;

TANTALUM COMPOUNDS;

EID: 28844484002     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1851544     Document Type: Article

References (33)

1. L. Martinu and D. Poitras, J. Vac. Sci. Technol. A 18, 2619 (2000).
2. T. Ellison, B. Dotter, M. Izu, and S. Ovshinsky, Proceedings of the 40th Annual Technical Conference, 12-17 April 1997, Society of Vacuum Coaters, Society of Vacuum Coaters, Albuquerque, NM, 1997, p. 309.
3. L. Martinu and J. E. Klemberg-Sapieha, in Optical Interference Coatings, edited by, N. Kaiser, and, H. K. Pulker, (Springer, Berlin, 2003), pp. 359-392.
4. M. Friz and F. Waibel, in Ref., pp. 105-130.
5. F. Rubio, J. Vac. Sci. Technol. 21, 1043 (1982).
6. N. Ozer and C. M. Lampert, J. Sol-Gel Sci. Technol. 8, 703 (1997).
7. C. G. Granqvist, Handbook of Inorganic Electrochromic Materials (Elsevier, Amsterdam, 1995).
8. B. T. Sullivan, G. A. Clarke, T. Akiyama, N. Osborne, M. Ranger, J. A. Dobrowolski, L. Howe, A. Matsumoto, S. Yizhou, and K. Kikuchi, Appl. Opt. 39, 157 (2000).
9. T. Doumuki, H. Tamada, and M. Saitoh, Appl. Phys. Lett. 64, 3533 (1994).
10. A. K. Chu, Y. S. Huang, and S. H. Tang, J. Vac. Sci. Technol. B 17, 455 (1999).
11. K. D. Pollard and R. J. Puddephatt, Chem. Mater. 11, 1069 (1999).
12. H. Li, W. A. Dawson, J. Roose, B. D. Hoppert, G. Grobe, and E. Leibenguth, Chemical Vapor Deposition, Proceedings of the 14th International Conference and EUROCVD-11, 5-9 September 1997., Electrochemical Soc, Paris, France, 1997, p. 811.
13. J.-Y. Zhang, Q. Fang, and I. W. Boyd, Appl. Surf. Sci. 138-139, 320 (1999).
14. K. Kukli, M. Ritala, and M. Leskelä, Chem. Mater. 12, 1914 (2000).
15. I. Watanabe and H. Yoshihara, Jpn. J. Appl. Phys., Part 2 24, 411 (1985).
16. S. Ezhilvalavan and T. Y. Tseng, J. Mater. Sci. 10, 9 (1999).
17. S. Bauer, L. Klippe, U. Rothhaar, and M. Kuhr, Thin Solid Films 442, 189 (2003).
18. J. E. Klemberg-Sapieha, O. M. Kuttel, L. Martinu, and M. R. Wertheimer, Thin Solid Films 193-194, 965 (1990).
19. L. Martinu, J. E. Klemberg-Sapieha, O. M. Kuttel, A. Raveh, and M. R. Wertheimer, J. Vac. Sci. Technol. A 12, 1360 (1994).
20. F. Urbach, Phys. Rev. 92, 1324 (1953).
21. W. C. Oliver and G. M. Pharr, J. Mater. Res. 7, 1564 (1992).
22. S. C. Gujrathi, in Metallization of Polymers, edited by, E. Sacher, J.-J. Pireaux, and, S. P. Kowalczyk, (American Chemical Society, Washington, DC, 1990), Vol. 440, pp. 88-109.
23. R. Messier, A. P. Giri, and R. A. Roy, J. Vac. Sci. Technol. A 2, 500 (1984).
24. A. Hallil, O. Zabeida, M. R. Wertheimer, and L. Martinu, J. Vac. Sci. Technol. A 18, 882 (2000).
25. H. Ono and K. Koyanagi, Appl. Phys. Lett. 77, 1431 (2000).
26. B. Orel, M. Macek, J. Grdadolnik, and A. Meden, J. Solid State Electrochem. 2, 221 (1998).
27. B.-O. Cho, S. X. Lao, and J. P. Chang, J. Appl. Phys. 93, 9345 (2003).
28. R. Urlaub, U. Posset, and R. Thull, J. Non-Cryst. Solids 265, 276 (2000).
29. W. Wang, D. Jia, Y. Zhou, and F. Ye, Mater. Res. Bull. 37, 2517 (2002).
30. Y. Imai, A. Watanabe, M. Mukaida, K. Osato, T. Tsunoda, T. Kameyama, and K. Fukuda, Thin Solid Films 261, 76 (1995).
31. E. Atanassova and D. Spassov, Appl. Surf. Sci. 135, 71 (1998).
32. S. C. Kuiry, S. Seal, W. Fei, J. Ramsdell, V. H. Desai, Y. Li, S. V. Babu, and B. Wood, J. Electrochem. Soc. 150, 36 (2003).
33. J.-P. Masse, H. Szymanowski, O. Zabeida, J. E. Klemberg-Sapieha, and L. Martinu, Thin Solid Films (submitted).