Effect of microstructure and dielectric materials on stress-induced damages in damascene Cu/low-k interconnects

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 241-252

  Joo, Young Chang ^a   Paik, Jong Min ^a   Jung, Jung Kyu ^a  

^a Seoul National University   (South Korea)

Author keywords

Damascene Cu; Finite element analysis; Low k dielectric; Microstructure; Stress; X ray diffraction

Indexed keywords

COPPER; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; MICROSTRUCTURE; THERMAL EXPANSION; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

DAMASCENE CU; LOW-K DIELECTRIC; VACANCY DIFFUSION;

OPTICAL INTERCONNECTS;

EID: 28844476817     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b7.6/o11.6     Document Type: Conference Paper

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