MOEMS chip-level optical fiber interconnect

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 612-618

  Deeds, Michael A ^a   Sandborn, Peter A ^b  

^a NAVAL SURFACE WARFARE CENTER   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Fluxless; Hermetic; Indium solder; Microelectromechanical system (MEMS); Microoptoelectromechanical system (MOEMS); Optical fiber; Package; Reliability

Indexed keywords

ELECTRONICS PACKAGING; FIBER OPTIC NETWORKS; HERMETIC DEVICES; MICROELECTROMECHANICAL DEVICES; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; REACTIVE ION ETCHING; RELIABILITY; SILICON ON SAPPHIRE TECHNOLOGY; SOLDERING;

DEEP REACTIVE ION ETCHING (DRIE); FLUXLESS; HIGHLY ACCELERATED LIFE TESTING (HALT); INDIUM SOLDER; MICROOPTOELECTROMECHANICAL SYSTEM (MOEMS); OPTICAL FIBER INTERCONNECT;

MICROPROCESSOR CHIPS;

EID: 28444468865     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.858340     Document Type: Article

References (29)

1. H. Last, M. Deeds, D. Garvick, R. Kaveisky, P. Sandbotn, E. B. Magrab, and S. K. Gupta, "Nano-to-millimeter scale integrated systems," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 2, pp. 338-343, Jun. 1999.
2. B. Hueners, "Packaging laser diodes for fiber optic transmission," Electron. Packag. Production, pp. 28-32, Sep. 2001.
3. S. J. Ok, C. Kim, and D. F. Baldwin, "High density, high aspect ratio through-wafer electrical interconnect vias for mems packaging," IEEE Trans. Adv. Packag., vol. 26, no. 3, pp. 302-309, Aug. 2003.
4. Y. C. Lee, B. A. Parviz, J. A. Chiou, and S. Chen, "Packaging for microelectromechanical and nanoelectromechanical systems," IEEE Trans. Adv. Packag., vol. 26, no. 3, pp. 217-226, Aug. 2003.
5. S. Picraux and P. McWhorter, "The broad sweep of integrated microsystems," IEEE Spectr., no. 12, pp. 24-33, Dec. 1998.
6. P. Van Kessel, L. Hornbeck, R. Meier, and M. Douglass, "A MEMS-based projection display," Proc. IEEE, vol. 86, no. 8, pp. 1687-1704, Aug. 1998.
7. (2005). Defense Advanced Research Projects Agency, Arlington, VA. [Online]. Available: http://www.darpa.millmto.
8. R. Johnson, "DARPA to fund optical interconnect research," EEtimes, Sep. 2003.
9. A. Mickelson, N. Basavanhally, and Y. C. Lee, Optoelectronic Pockaging. New York: Wiley, 1997.
10. F. Bushroe, "Getting light in and out of your hermetic photonic package," in Proc. PhoPack, 2002.
11. K. Cochran, L. Fan, and D. DeVoe, "Moving reflector type micro optical switch for high-power transfer in a MEMS-based safety and arming system," J. Micromech. Microeng., vol. 14, no. 1, pp. 138-146, 2004.
12. K. Cochran, L. Fan, and D. L. DeVoe, "High-Power optical micro switch fabricated by deep reactive ion etching (DRIE)," Proc. SPIE 4983:MOEMS and Miniaturized Systems III, pp. 75-86, 2003.
13. M. Deeds, P. Sandborn, and R. Swaminathan, "Packaging of a MEMS based safety and arming device," in Proc. Int. Soc. Conf. Thermal Phenomena (ITHERM), 2000, pp. 101-112.
14. R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, "Reliability assessment of delamination in chip-to-Chip bonded MEMS packaging," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 2, pp. 141-151, May 2003.
15. M. Deeds and K. Cochran, "Microchip-level optical interconnect," U.S. Patent 6 835 582, Jan. 2003.
16. M. Deeds, "Qualification of metallized optical fiber connections for chip-level MEMS packaging," Ph.D. dissertation, Dept. Mech. Eng., Univ. Maryland, College Park, 2004.
17. S. Renard and V. Gaff, "The promise of generic micro-machining technology for MEMS," Sensors, vol. 18, no. 7, pp. 59-63, Jul. 2001.
18. M. Madou, Fundamentals of Microfabrication. New York: CRC, 1997.
19. J. Kuhmann, A. Preuss, B. Adolphi, K. Maly, T. Wirth, W. Oesterle, W. Pittroff, G. Weyer, and M. Fanciulli, "Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: A knowledge base for fluxless solder bonding applications," IEEE Trans. Compon., Packag., Manuf. Technol. C, vol. 21, no. 2, pp. 134-141, Apr. 1998.
20. M. Taklo, P. Storas, K. Schjolberg, H. Hasting, and H. Jakobsen, "Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold," J. Micomech. Microeng., vol. 14, no. 7, pp. 884-890, 2004.
21. D. Stark, "Novel hermetic packaging methods for MOEMS," Proc. SPIE, vol. 4980, pp. 289-300, 2003.
22. T. M. H. Lee, I. M. Hsing, and C. Y. N. Liaw, "An improved anodic bonding process using pulsed voltage technique," J. Microelectromech. Syst., vol. 9, pp. 469-473, 2000.
23. Y. C. Lee and N. R. Basavanhally, "Overview: Solder engineering for optoelectronic packaging," J. Minerals, Metals, Mater, pp. 46-50, Jun. 1994.
24. K. F. Harsh, V. M. Bright, and Y. C. Lee, "Micro-scale limits of solder self-assembly for MEMS," Microelectron. Packag., vol. 4980, pp. 243-252, 2001.
25. M. Deeds and P. Sandborn, "Indium soldering for a MOEMS based safety and arming device," in Proc. SMTA Pan Pacific Conf., Feb. 2004, pp. 373-379.
26. A. Jourdain, P. De Moor, S. Pamidighantam, and H. Tilmans, "Investigation of the hermeticity of beb-sealed cavities for housing rf-mems devices," in Proc. IEEE Micro Electro Mechanical Systems (MEMS), 2002, pp. 677-680.
27. G. Elger, L. Shiv, N. Nikac, F. Muller, R. Liebe, M. Grigat, and M. Heschel, "Optical leak detection for wafer level herineticity testing," in Proc. IEEE/CPMT Int. Electronics Manufacturing Technology Symp., vol. 29, 2004, pp. 326-331.
28. Y. Tao and A. Malshe, "Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E," Microelectron. Rel., vol. 45, no. 3-4, pp. 559-566, 2005.
29. Dept. Defense Test Method Standard, Microcircuits, MIL-STD-883E, 1996