Packaging of a MEMS based safety and arming device

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 107-112

  Deeds, Michael ^a   Sandborn, Peter ^a   Swaminathan, Rajesh ^a  

^a Cent   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL CONDITIONING; SAFETY AND ARMING DEVICE; UNDERWATER WEAPONS;

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; ENVIRONMENTAL TESTING; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; MICROMACHINING; ORDNANCE;

MICROELECTROMECHANICAL DEVICES;

EID: 0033710194     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)