Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 559-566

  Tao, Yi ^a   Malshe, Ajay P ^b  

^a UNIVERSITY OF ARKANSAS   (United States)

^b University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; HELIUM; INTEGRATED CIRCUITS; SENSITIVITY ANALYSIS; SENSORS;

HELIUM BOMB TESTS; HERMETICITY TESTING; MICROELECTROMECHANICAL SYSTEMS (MEMS); PRESSURE SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 15744367086     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.08.004     Document Type: Article

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