Optical leak detection for wafer level hermeticity testing

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 326-331

  Elger, Gordon ^a   Shiv, Lior ^b   Nikac, Nika ^a   Müller, Frank ^a   Liebe, Rainer ^c   Grigat, Marcus ^c   Heschel, Matthias ^b  

^a Hymite GmbH   (Germany)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^c NANOFOCUS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER AIDED DESIGN; CRACKS; HERMETIC DEVICES; INTEGRATED CIRCUITS; MASS SPECTROMETERS; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; OPTOELECTRONIC DEVICES; PACKAGING;

COMMERCIALIZATION; DESIGN ITERATIONS; MEMS TECHNOLOGY; WAFER FABRICATION;

LEAK DETECTION;

EID: 4644224614     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. MIL-STD-883E, Test Method Standard Microcircuits, Department of Defense, USA, (1996).
2. A. Jourdain, et. al., Investigation of the hermeticity of BCB-sealed cavities for housing RF MEMS Devices, MEMS 2002 IEEE International Conference, pp.677-80.2
3. http://www.norcomsysteminc.com http://www.nanofocus.de
4. H. Greenhouse, Hermeticity of Electronic Packages, Noyes Publication (Ney York 2000), p196ff.
5. H. Madsen, et. al, Automated Assembly and Packaging of Hybrid Optical Modules, 53rd ECTC 2003 IEEE International Conference, pp.1295-1300