Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 2, 2003, Pages 141-151

  Swaminathan, Rajesh ^a,b   Bhaskaran, Harish ^a   Sandborn, Peter A ^a   Subramanian, Gowrishankar ^a,c   Deeds, Michael A ^d   Cochran, Kevin R ^d  

^a UNIVERSITY OF MARYLAND   (United States)

^b LUCENT TECHNOLOGIES   (United States)

^c ADVANCED MICRO DEVICES   (United States)

^d NAVAL SURFACE WARFARE CENTER   (United States)

Author keywords

Chip to chip bonding; Delamination; Die shear; MEMS; MEMS packaging; Reliability; Scanning acoustic microscopy

Indexed keywords

ACOUSTIC MICROSCOPES; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; NONDESTRUCTIVE EXAMINATION;

CHIP-TO-CHIP BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0141953893     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817344     Document Type: Article

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