Thermal management and characterization of flip chip BGA packages

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 53-59

  Krishnamoorthi, S ^a   Chong, Desmond Y R ^a   Sun, Anthony Y S ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

Author keywords

CFD modeling and simulation; Flip chip; Thermal measurement and thermal performance; Thermal resistance

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT RESISTANCE; MATHEMATICAL MODELS; SOLDERED JOINTS; SUBSTRATES; THERMAL EFFECTS; THERMAL VARIABLES MEASUREMENT; THERMODYNAMICS;

CFD MODELING AND SIMULATION; FLIP CHIPS; RELIABILITY MEASUREMENTS; THERMAL MEASUREMENT AND THERMAL PERFORMANCE;

FLIP CHIP DEVICES;

EID: 28444448075     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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6. th Electronics Packaging Technology Conf, 2003, pp 485-490.
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8. EIA/JESD51-4, "Thermal test chip guideline", Feb 1997.