Thermal modeling and management in ultrathin chip stack technology

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 2, 2002, Pages 244-253

  Pinel, Stéphane ^a   Marty, Antoine ^a   Tasselli, Josiane ^a   Bailbe, Jean Pierre ^a   Beyne, Eric ^b   Van Hoof, Rita ^b   Marco, Santiago ^c   Morante, Joan Ramon ^c   Vendier, Olivier ^d   Huan, Marc ^d  

^a LAAS CNRS   (France)

^b IMEC   (Belgium)

^c UNIVERSITY OF BARCELONA   (Spain)

^d THALES ALENIA SPACE   (France)

Author keywords

3 D integration; Benzocyclobutene; Copper; FEM; MCM; Thermal simulation; Thermal transient; Thin dies

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; COPPER; DIES; FINITE ELEMENT METHOD; HEAT TRANSFER; MULTICHIP MODULES; THERMAL CONDUCTIVITY; TRANSIENTS;

BENZOCYCLOBUTENE (BCB);

CHIP SCALE PACKAGES;

EID: 0036613761     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.1010013     Document Type: Article

References (16)

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