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Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 78-84

Die attach quality control of 3D stacked dies

(6) Rencz, M a Szekely V b Courtois, B c Zhang, L d Howard, N d Nguyen, L d

a MicReD Ltd (Hungary)

b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS (Hungary)

c TIMA LABORATORY (France)

d NATIONAL SEMICONDUCTOR CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FUNCTIONS; HEAT FLUX; HEAT RESISTANCE; MICROELECTRONICS; MICROSENSORS;

HEAT FLOW; STACKED DIES; THERMAL CAPACITANCE; THERMAL IMPEDANCE;

ELECTRONICS PACKAGING;

EID: 4644297453 PISSN: 10898190 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (14)

References (9)

1
- 0024069775
- Fine structure of heat flow path in semiconductor devices: A measurement and identification method
- V. Székely and Tran Van Bien: "Fine structure of heat flow path in semiconductor devices: a measurement and identification method", Solid-State Electronics, V.31, pp. 1363-1368 (1988)
- (1988) Solid-State Electronics , vol.31 , pp. 1363-1368
- Székely, V.¹ Van Bien, T.²

2
- 0036212684
- Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities
- March 1-14, San Jose, CA,USA
- M. Rencz, V. Székely, A. Morelli, C. Villa: Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities, Proceedings of the XVIIIth SEMI-THERM Symposium, March 1-14 2002, San Jose, CA,USA pp 15-20
- (2002) Proceedings of the XVIIIth SEMI-THERM Symposium , pp. 15-20
- Rencz, M.¹ Székely, V.² Morelli, A.³ Villa, C.⁴

3
- 2342646748
- Structure function evaluation of stacked dies
- March 9-11, San Jose, CA,USA
- M. Rencz, V. Székely: Structure function evaluation of stacked dies, Proceedings of the XXth SEMI-THERM Symposium, March 9-11, 2004, San Jose, CA,USA, pp 50-54.
- (2004) Proceedings of the XXth SEMI-THERM Symposium , pp. 50-54
- Rencz, M.¹ Székely, V.²

4
- 84937078370
- Theory of nonuniform RC lines
- E.N. Protonotarios, O. Wing: "Theory of nonuniform RC lines", IEEE Trans. on Circuit Theory, V.14, No.1, pp. 2-12 (1967)
- (1967) IEEE Trans. on Circuit Theory , vol.14 , Issue.1 , pp. 2-12
- Protonotarios, E.N.¹ Wing, O.²

5
- 2342531628
- Thermal characterization of stacked dies
- March 9-11, San Jose, CA,USA
- L. Zhang, N. Howard, V. Gumaste, A. Poddar, L. Nguyen: Thermal characterization of stacked dies, Proceedings of the XXth SEMI-THERM Symposium, March 9-11, 2004, San Jose, CA,USA, pp 55-63.
- (2004) Proceedings of the XXth SEMI-THERM Symposium , pp. 55-63
- Zhang, L.¹ Howard, N.² Gumaste, V.³ Poddar, A.⁴ Nguyen, L.⁵

6
- 0032676707
- SUNRED, a new field solving approach
- 30 March - 1 April, Paris, France
- V. Székely, A. Páhi, M. Rencz: SUNRED, a new field solving approach. Symposium on Design, Test and Microfabrication of MEMS/MOEMS, 30 March - 1 April, 1999, Paris, France, pp. 278-288
- (1999) Symposium on Design, Test and Microfabrication of MEMS/MOEMS , pp. 278-288
- Székely, V.¹ Páhi, A.² Rencz, M.³

7
- 4644354515
- http://www.delphi.com/pdf/techpapers/2004-01-1681.pdf

8
- 4644236513
- http://www.micred.com/index1.html

9
- 2342617400
- A procedure to correct the error in the structure function based thermal measuring methods
- March 9-11, San Jose, CA,USA
- M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, B. Courtois: A procedure to correct the error in the structure function based thermal measuring methods, Proceedings of the XXth SEMI-THERM Symposium, March 9-11, 2004, San Jose, CA,USA, pp 92-98
- (2004) Proceedings of the XXth SEMI-THERM Symposium , pp. 92-98
- Rencz, M.¹ Poppe, A.² Kollár, E.³ Ress, S.⁴ Székely, V.⁵ Courtois, B.⁶

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