Integration of electroless copper for seed repair

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 259-261

  Witt, C ^a,b   Frank, A ^a,c   Webb, E ^e   Reid, J ^e   Pfeifer, K ^a,d  

^a SEMATECH   (United States)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c TEXAS INSTRUMENTS   (United States)

^d NXP SEMICONDUCTORS   (Netherlands)

^e Portland Technology Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; DEPOSITION; PHYSICAL VAPOR DEPOSITION; REPAIR; SEMICONDUCTOR DEVICE MANUFACTURE; VAPOR DEPOSITION;

DUAL DAMASCENE STRUCTURES; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; HIGH ASPECT RATIO; INTERNATIONAL SEMATECH; INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS; SINGLE DAMASCENE; TECHNOLOGY NODES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84961752101     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014951     Document Type: Conference Paper

References (8)

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