Determination of visco-elastic properties during the curing process of underfill materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1070-1077

  Ernst, L J ^a   Van't Hof, C ^a   Yang, D G ^a   Kiasat, M S ^a   Zhang, G Q ^b   Bressers, H J L ^b   Caers, J F J ^b   Den Boer, A W J ^b   Janssen, J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURING; EPOXY RESINS; PARAMETER ESTIMATION; RELIABILITY; STRAIN; STRESSES; THERMOSETS; VISCOELASTICITY;

MECHANICAL SIMULATION; THERMAL SIMULATION; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0034476318     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)