Parameter sensitivity study of cure-dependent underfill properties on Flip Chip failures

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 865-872

  Yang, D G ^a   Zhang, G Q ^b   Van Driel, W ^b   Janssen, J ^c   Bressers, H J L ^c   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; ELASTIC MODULI; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; SENSITIVITY ANALYSIS; SOLDERING ALLOYS; STIFFNESS; STRESSES; VISCOELASTICITY;

DIE CRACKING;

FLIP CHIP DEVICES;

EID: 0036297128     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008202     Document Type: Article

References (22)

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