Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 919-924

  Yang, D G ^a   Zhang, G Q ^b   Ernst, L J ^a   Caers, J F J ^b   Bressers, H J L ^b   Janssen, J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CURING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; NUMERICAL ANALYSIS; PLASTICS FILLERS; SOLDERED JOINTS; STRAIN; STRESSES; THERMAL CYCLING; VISCOELASTICITY;

COFFIN-MANSON BASED FATIGUE RELATION; CREEP FATIGUE MODEL; FLIP CHIP ON BOARD; FLIP CHIP SOLDER; UNDERFILL PROPERTIES;

ELECTRONICS PACKAGING;

EID: 0034829035     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927904     Document Type: Article

References (13)

1. Solder joint fatigue models: Review and applicability to chip scale packages
2. Thermomechanical analysis of solder joint fatigue and creep in a flip chip on borad package subjected to temperature cycling loading
3. Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies
4. Shrinkage and stress build up in unsaturated polyester resin during curing
5. Curing shrinkage and residual stress in viscoelastic thermosetting resins and composites
6. Mechanical characterisation and simulation of curing packaging polymers
7. Thermo-mechanical characterization of packaging polymers during the curing process
8. Determination of visco-elastic properties during the curing process of encapsulate materials
9. Vertical die crack stresses of flip chip induced in major package assembly processes
10. Constitutive relations for tin-based solder joints
11. Fatigue of 60/40 solder
12. Constitutive relation and creep-fatigue life model for eutectic tin lead solder