Performance study of new segmented overlay marks for advanced wafer processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5038 I, Issue , 2003, Pages 453-463

  Adel, M ^b   Allgair, J A ^a   Benoit, D C ^a   Ghinovker, M ^b   Kassel, E ^b   Nelson, C ^c   Robinson, J C ^c   Seligman, G S ^a  

^a MOTOROLA INC   (United States)

^b KLA TENCOR CORPORATION   (United States)

^c KLA Tencor Austin   (United States)

Author keywords

Box in box; Grating target; Optical metrology; Overlay; Overlay mark

Indexed keywords

ALGORITHMS; CHEMICAL MECHANICAL POLISHING; DIFFRACTION GRATINGS; INTEGRATED CIRCUIT LAYOUT; LITHOGRAPHY; PERFORMANCE; SEMICONDUCTOR DEVICE MANUFACTURE;

BOX IN BOX OVERLAY MARKS; DESIGN RULE SEGMENTATION; OPTICAL OVERLAY METROLOGY; OVERLAY MARK; OVERLAY MARK FIDELITY; SHORT LOOP WAFERS; TOTAL MEASUREMENT UNCERTAINTY;

OPTICAL VARIABLES MEASUREMENT;

EID: 0141611995     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.483477     Document Type: Conference Paper

References (4)

1. Plambeck, Bert F.; Knoll, Noam; Lord, Patrick, Characterization of Chemical Mechanical Polished Overlay Targets Using Coherence probe Microscopy, Integrated Circuit Metrology, Inspection and Process Control IX, Proceedings of SPIE Vol. 2439 (1995), p.298
2. Luci, Alberto; Ballarin, Eugenio G. Optimization of Overlay Markers to Limit measurement error Induced During Exposure by lens Aberration Effects, Metrology, Inspection, and process Control for Microlithography XVI, Proceedings of SPIE Vol. 4690 (2002), p.374.
3. M. Adel, M. Ghinovker, B. Golovanevsky, P. Izikson, E. Kassel, D. Yaffe, F. Bruckstein, R. Goldenberg, Y. Rubner, & M. Rudzsky Optimized overlay metrology fiducials: theory and experiment, to be published in IEEE Transactions on Semiconductor Manufacturing
4. Mike Adel, Mark Ghinovker, Jorge Poplawski, Elyakim Kassel, Pavel Izikson, Ivan Pollentier, Philippe Leray, David Laidler Characterization of Overlay Mark Fidelity, to be published in these proceedings.