High-quality cutting of polished single-crystal silicon by wire electrical discharge machining

Precision Engineering

Volumn 29, Issue 4, 2005, Pages 423-430

  Takino, Hideo ^a   Ichinohe, Toshimitsu ^a   Tanimoto, Katsunori ^a   Yamaguchi, Syuichi ^a   Nomura, Kazushi ^a   Kunieda, Masanori ^b  

^a NIKON CORPORATION   (Japan)

^b TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

Author keywords

Cut; Mirror; Optics; Roughness; Silicon; Surface; Wire electrical discharge machining (WEDM)

Indexed keywords

CUTTING; ELECTRIC DISCHARGES; MACHINING; MASKS; MIRRORS; PLATES (STRUCTURAL COMPONENTS); POLISHING; RESINS; SILICON; SINGLE CRYSTALS; SURFACE ROUGHNESS;

CUT; SURFACE; WIRE ELECTRICAL DISCHARGE MACHINING (WEDM);

SURFACE TREATMENT;

EID: 24944515744     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2004.12.004     Document Type: Article

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