Fabrication of multi-tiered structures on step and flash imprint lithography templates

Microelectronic Engineering

Volumn 67-68, Issue , 2003, Pages 221-228

  Johnson, S ^b   Resnick, D J ^a   Mancini, D ^a   Nordquist, K ^a   Dauksher, W J ^a   Gehoski, K ^a   Baker, J H ^a   Dues, L ^a   Hooper, A ^a   Bailey, T C ^b   Sreenivasan, S V ^b   Ekerdt, J G ^b   Willson, C G ^b  

^a MOTOROLA INC   (United States)

^b The University of Texas at Austin   (United States)

Author keywords

Flash; Imprint; Lithography; Multi tiered structures; Step

Indexed keywords

ETCHING; INDIUM COMPOUNDS; QUARTZ; SILICON WAFERS;

FLASH IMPRINT LITHOGRAPHY;

LITHOGRAPHY;

EID: 0038020953     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00075-3     Document Type: Conference Paper

References (10)

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2. Colburn M., Johnson S., Stewart M., Damle S., Bailey T., Choi B., Wedlake M., Michaelson T., Sreenivasan S.V., Ekerdt J., Willson C.G. Proc. SPIE Emerg. Lithogr. Technol. III:1999;379.
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