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Volumn 366, Issue , 2000, Pages 407-411

Numerical analysis of buoyancy-induced flow and heat transfer in an enclosure with vents

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Indexed keywords


EID: 0345813320     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (8)

References (10)
  • 2
    • 0032678362 scopus 로고    scopus 로고
    • Integrated thermal analysis of natural convection air cooled electronic enclosure
    • Tang, L. Joshi, Y.K., (1999), "Integrated thermal analysis of natural convection air cooled electronic enclosure", ASME, J. Electron. Packag., 121, 2, pp. 108-15.
    • (1999) ASME, J. Electron. Packag. , vol.121 , Issue.2 , pp. 108-115
    • Tang, L.1    Joshi, Y.K.2
  • 3
    • 0031237619 scopus 로고    scopus 로고
    • Thermal phenomena in compact electronic enclosures: A numerical study
    • Maudgal, V.K., (1997), "Thermal phenomena in compact electronic enclosures: a numerical study", IEEE Trans. Compon. Packag. Manuf. Technol. A, 20, 3, pp.286-94.
    • (1997) IEEE Trans. Compon. Packag. Manuf. Technol. A , vol.20 , Issue.3 , pp. 286-294
    • Maudgal, V.K.1
  • 5
    • 0033393945 scopus 로고    scopus 로고
    • Three dimensional study of combined conduction, radiation, and natural convection from discrete heat sources in a horizontal narrow aspect ratio enclosure
    • Adams, V.H. Joshi, Y. Blackburn, D.L., (1999), "Three dimensional study of combined conduction, radiation, and natural convection from discrete heat sources in a horizontal narrow aspect ratio enclosure", Trans. ASME, J. Heat Transfer, 12, 4, pp. 992-1001
    • (1999) Trans. ASME, J. Heat Transfer , vol.12 , Issue.4 , pp. 992-1001
    • Adams, V.H.1    Joshi, Y.2    Blackburn, D.L.3
  • 6
    • 0032023268 scopus 로고    scopus 로고
    • Natural convection air cooling of a discrete heat source on a conducting board in a shallow horizontal enclosure
    • Ortega, A. Lall, B.S., (1998), "Natural convection air cooling of a discrete heat source on a conducting board in a shallow horizontal enclosure", Trans. ASME, J. Electron. Packaging, 120, 1, pp. 89-97
    • (1998) Trans. ASME, J. Electron. Packaging , vol.120 , Issue.1 , pp. 89-97
    • Ortega, A.1    Lall, B.S.2
  • 9
    • 4243160082 scopus 로고    scopus 로고
    • A Numerical study of the thermal performance of a Tape Ball Grid Array (TBGA) package
    • Sathe, S.B., and Sammakia, (1996), "A Numerical study of the thermal performance of a Tape Ball Grid Array (TBGA) package", 31st ASME National Heat Transfer Conference, HTD Vol 309, pp 83-94
    • (1996) 31st ASME National Heat Transfer Conference , vol.309 HTD , pp. 83-94
    • Sathe, S.B.1    Sammakia2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.