Effect of thermal cycling on the adhesion strength of Sn-9Zn-xAg-Cu interface

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 1, 2004, Pages 158-164

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b   Lin, Dong Yih ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

Adhesion strength; Interface; Lead free solder; Thermal cycling

Indexed keywords

ADHESION; ENERGY DISPERSIVE SPECTROSCOPY; HEAT RESISTANCE; MATERIALS TESTING; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

ADHESION STRENGTH; COEFFICIENT OF THERMAL EXPANSION; FRACTURE MORPHOLOGY; KIRKENDALL VOIDS; LEAD FREE SOLDER; THERMAL CYCLIC RESISTANCE; TIN ZIN SILVER COOPER ALLOYS;

INTERFACES (MATERIALS);

EID: 2442604475     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.825377     Document Type: Article

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