-
1
-
-
0028203211
-
Mechanical testing of thin films
-
Brotzen FR (1994) Mechanical testing of thin films, Int. Mater. Rev. 39(1): 24-45
-
(1994)
Int. Mater. Rev.
, vol.39
, Issue.1
, pp. 24-45
-
-
Brotzen, F.R.1
-
3
-
-
0026875935
-
An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments
-
Oliver WC; Pharr GM (1992) An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments. J Mater Res 7(6): 1564-1571
-
(1992)
J Mater Res
, vol.7
, Issue.6
, pp. 1564-1571
-
-
Oliver, W.C.1
Pharr, G.M.2
-
4
-
-
0342827709
-
Characterization of thin films using micromechanical structures
-
Pratt RI et al (1994) Characterization of thin films using micromechanical structures. Mat Res Soc Symp Proc 276: 197-202
-
(1994)
Mat Res Soc Symp Proc
, vol.276
, pp. 197-202
-
-
Pratt, R.I.1
-
6
-
-
0018541427
-
Young's modulus measurements of thin films using micromechanics
-
Petersen KE; Guarnieri CR (1979) Young's modulus measurements of thin films using micromechanics J App Phys 50(11): 6761-6766
-
(1979)
J App Phys
, vol.50
, Issue.11
, pp. 6761-6766
-
-
Petersen, K.E.1
Guarnieri, C.R.2
-
9
-
-
0024139306
-
Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures
-
Hilton Head Island, SC
-
Maseeh F; Schmidt MA; Allen MG; Senturia SD (1988) Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures. IEEE Solid State Sensor and Actuator Workshop, Hilton Head Island, SC: 84-87
-
(1988)
IEEE Solid State Sensor and Actuator Workshop
, pp. 84-87
-
-
Maseeh, F.1
Ma, S.2
Allen, M.G.3
Senturia, S.D.4
-
10
-
-
0035279276
-
Microscale material testing using MEMS actuator
-
Haque MA; Saif MT (2001) Microscale material testing using MEMS actuator. J Microelectromechanical Systems10(1): 146-152
-
(2001)
J Microelectromechanical Systems
, vol.10
, Issue.1
, pp. 146-152
-
-
Ma, H.1
Saif, M.T.2
-
11
-
-
0002193058
-
Mechanical charaterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures
-
Greek S; Ericson F; Johansson S; Furtsch M; Rump A (1999) Mechanical charaterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures. J Micromech Microeng 9(3): 245-251
-
(1999)
J Micromech Microeng
, vol.9
, Issue.3
, pp. 245-251
-
-
Greek, S.1
Ericson, F.2
Johansson, S.3
Furtsch, M.4
Rump, A.5
-
12
-
-
0006116259
-
Electronic determination of the modulus of elasticity and intrinsic stress of thin film using capacitive bridge
-
Wang S; Cary S; Najafi K (1992) Electronic determination of the modulus of elasticity and intrinsic stress of thin film using capacitive bridge. Mater Res Soc Symp Proce 276: 203-208
-
(1992)
Mater Res Soc Symp Proce
, vol.276
, pp. 203-208
-
-
Wang, S.1
Cary, S.2
Najafi, K.3
-
13
-
-
0036772937
-
Measurements of material properties using differential capacitive strain sensors
-
Larry L; Long Q; Yogesh BG (2002) Measurements of Material Properties Using Differential Capacitive Strain Sensors. J Microelectromechanical Systems 11(5): 489-498
-
(2002)
J Microelectromechanical Systems
, vol.11
, Issue.5
, pp. 489-498
-
-
Larry, L.1
Long, Q.2
Yogesh, B.G.3
-
14
-
-
0001951875
-
Microfabricated structures for the measurement of mechanical properties and adhesion
-
Tokyo, Japan
-
Senturia SD (1987) Microfabricated structures for the measurement of mechanical properties and adhesion. Proc. Transducers 87, Tokyo, Japan: 11-16
-
(1987)
Proc. Transducers
, vol.87
, pp. 11-16
-
-
-
15
-
-
84972102741
-
Mechanical characterization of thin films by micromechanical techniques
-
Schweitz JA (1992) Mechanical characterization of thin films by micromechanical techniques. MRS Bull: 34-45
-
(1992)
MRS Bull
, pp. 34-45
-
-
Schweitz, J.A.1
-
17
-
-
5544274244
-
Microfabricated structures for the in situ measurement of residual stress, young's modulus and ultimate strain of thin films
-
Allen MG; Mehregany M; Howe R; Senturia S (1987) Microfabricated Structures for the in situ Measurement of Residual Stress, Young's Modulus and Ultimate Strain of Thin Films. Appl Phys Lett 51: 241-243
-
(1987)
Appl Phys Lett
, vol.51
, pp. 241-243
-
-
Allen, M.G.1
Mehregany, M.2
Howe, R.3
Senturia, S.4
-
19
-
-
0035439352
-
Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS
-
Jensen BD; de Boer MP; Masters ND; Bitsie F; LaVan DA (2001) Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS. J Microelectromechanical Systems 10(3): 336-346
-
(2001)
J Microelectromechanical Systems
, vol.10
, Issue.3
, pp. 336-346
-
-
Jensen, B.D.1
De Boer, M.P.2
Masters, N.D.3
Bitsie, F.4
LaVan, D.A.5
-
20
-
-
0025644073
-
Measurement of Young's modulus of microfabricated structures using a surface profile
-
Tai YC; Muller RS (1990) Measurement of Young's modulus of microfabricated structures using a surface profile. IEEE MEMS Conference: 147-152
-
(1990)
IEEE MEMS Conference
, pp. 147-152
-
-
Tai, Y.C.1
Muller, R.S.2
-
21
-
-
85041106620
-
Determination of Young's modulus pf electroplated nickel-iron (Ni/Fe) and micro-machined Si thin films by the balance method
-
Zhang J (2002) Determination of Young's modulus pf electroplated nickel-iron (Ni/Fe) and micro-machined Si thin films by the balance method. J Materials Processing Technology 123: 329-335
-
(2002)
J Materials Processing Technology
, vol.123
, pp. 329-335
-
-
Zhang, J.1
-
22
-
-
0029303827
-
New methods for measuring mechanical properties of thin films in micromachining: Beam pull-in voltage method(Vpi) and long beam deflection (LBD) method
-
Zou Q; Li Z; Li L (1995) New methods for measuring mechanical properties of thin films in micromachining: beam pull-in voltage method(Vpi) and long beam deflection (LBD) method. Sensors and Actuators A 48: 137-143
-
(1995)
Sensors and Actuators A
, vol.48
, pp. 137-143
-
-
Zou, Q.1
Li, Z.2
Li, L.3
-
23
-
-
5544274244
-
A novel technique and structure for the measurement of intrinsic stress and Young's modulus, and ultimate strain of thin films
-
Najafi K; Suzuki K (1987) A novel technique and structure for the measurement of intrinsic stress and Young's modulus, and ultimate strain of thin films. Appl Phys Lett 51: 241-243
-
(1987)
Appl Phys Lett
, vol.51
, pp. 241-243
-
-
Najafi, K.1
Suzuki, K.2
-
24
-
-
0031168990
-
M-test: A test chip for MEMS material property measurement using electrostatically actuated test structures
-
Perter MO; Stephen DS (1997) M-test: A Test Chip for MEMS Material Property Measurement Using Electrostatically Actuated Test Structures, J of Microelectromechanical Systems 6(2): 107-118
-
(1997)
J of Microelectromechanical Systems
, vol.6
, Issue.2
, pp. 107-118
-
-
Perter, M.O.1
Stephen, D.S.2
-
25
-
-
0003366890
-
Integrated platform for testing MEMS mechanical properties at the wafer scale by the imaP methodology
-
De Boer MP et al Integrated Platform for testing MEMS Mechanical Properties at the Wafer Scale by the ImaP Methodology. Mechanical Properties of Structural Films, STP 1413
-
Mechanical Properties of Structural Films, STP
, pp. 1413
-
-
De Boer, M.P.1
-
26
-
-
0033148946
-
A microstructure for in situ determination of residual strain
-
Pan CH; Hsu W (1999) A Microstructure for in situ Determination of Residual Strain, IEEE J. Microelectromechanical Systems 8(2): 200-207
-
(1999)
IEEE J. Microelectromechanical Systems
, vol.8
, Issue.2
, pp. 200-207
-
-
Ch, P.1
Hsu, W.2
-
27
-
-
0036735411
-
A simple method for determining linear thermal expansion coefficients of thin films
-
Pan CH (2002) A Simple Method for Determining Linear Thermal Expansion Coefficients of Thin Films, J Micromech and Microeng 12: 548-555
-
(2002)
J Micromech and Microeng
, vol.12
, pp. 548-555
-
-
Pan, Ch.1
|