A simple method for determining linear thermal expansion coefficients of thin films

Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 548-555

  Pan, Chi Hsiang ^a  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; MASKS; MATHEMATICAL MODELS; MICROSTRUCTURE; NONLINEAR EQUATIONS; OPTICAL MICROSCOPY; POISSON RATIO; THERMAL EFFECTS; THERMAL EXPANSION; THIN FILMS;

COMPACT MICROMACHINED STRUCTURE; FINITE ELEMENT MODEL; LINEAR THERMAL EXPANSION COEFFICIENTS; POLYCRYSTALLINE SILICON FILM;

MICROMACHINING;

EID: 0036735411     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/5/306     Document Type: Article

References (27)

1. Mechanical and optical characterization of thermal microactuators fabricated in a CMOS process
2. Determination of an effective coefficient of thermal expansion of electronic packaging components: A whole-field approach
3. Applications of silicon-microactuators based on bimorph structures
4. Biaxial scanning mirror activated by bimorph structures for medical applications
5. Analysis of tip deflection and force of a bimetallic cantilever microactuator
6. Thermo-magnetic metal flexure actuators
7. Modelization and characterization of asymmetrical thermal micro-actuator
8. An electro-thermally driven polysilicon microactuator
9. Process-dependent thermal physical properties of CMOS IC thin films
10. Process-dependent thin-film thermal conductivities for thermal CMOS MEMS
11. Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 K and 1500 K
12. A sensitive dilatometer for use at low temperatures
13. A new interferometer capable of measuring small optical path differences
14. Thermal variation apparatus for x-ray diffraction experiments up to 3000 K
15. A silicon powder diffraction standard reference material
16. High-temperature x-ray diffraction furnace using a thermal-image technique
17. Linear thermal expansion measurement on silicon from 6 to 340 K
18. A high-temperature attachment for precise measurement of lattice parameters by Bond's method between room temperature and 1500 K
19. Elastic stiffness and thermal expansion coefficient of BN films
20. Effect of phosphorus doping on stress in silicon and polycrystalline silicon
21. Extraction of the coefficient of thermal expansion of thin films from buckled membranes
22. Measurement of thermal expansion coefficient of poly-Si using microgauge sensors
23. Determining thermal expansion coefficients of thin films using micromachined cantilevers
24. A microstructure for in-situ determination of residual strain
25. Comments on measuring thin-film stresses using Bi-layer micromachined beams