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Volumn 123, Issue 3, 2002, Pages 329-335

Determination of Young's modulus of electroplated nickel-iron (Ni/Fe) and micro-machined Si thin films by the balance method

Author keywords

Balance method; Electroplating; Ni Fe thin films; UV LIGA technology; Young's modulus

Indexed keywords

CANTILEVER BEAMS; ELASTIC MODULI; ELECTROPLATING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON;

EID: 85041106620     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(02)00012-2     Document Type: Article
Times cited : (16)

References (21)
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    • Schweitz, J.A.1
  • 10
    • 0000168554 scopus 로고    scopus 로고
    • Determination of the elastic modulus of thin film materials using self-deformed micromachined cantilevers
    • (1999) J. Micromech. Microeng. , vol.9 , pp. 230-235
    • Fang, W.1
  • 14
    • 0031168990 scopus 로고    scopus 로고
    • M-test: A test chip for MEMS material property measurement using electrostatically actuated test structures
    • (1997) J. MEMS , vol.6 , Issue.2 , pp. 107-118
    • Osterberg, P.M.1    Sentura, S.D.2
  • 20
    • 0030405949 scopus 로고    scopus 로고
    • Invar electrodeposition for MEMS applications
    • (1996) SPIE , vol.2879 , pp. 252-259
    • Hirano, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.