Temperature and supply voltage aware performance and power modeling at microarchitecture level

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 24, Issue 7, 2005, Pages 1042-1053

  Liao, Weiping ^a   He, Lei ^a   Lepak, Kevin M ^b  

^a University of California   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

Floorplan; Leakage power; Microarchitecture; Temperature; Thermal management

Indexed keywords

ELECTRIC POWER SYSTEMS; ELECTRIC POWER UTILIZATION; INDUSTRIAL MANAGEMENT; LEAKAGE CURRENTS; MATHEMATICAL MODELS; THERMAL EFFECTS; VLSI CIRCUITS;

FLOORPLAIN; LEAKAGE POWER; MICROARCHITECTURE; THERMAL MANAGEMENT;

ELECTRIC POTENTIAL;

EID: 22544456242     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2005.850860     Document Type: Article

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