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Volumn 33, Issue 7, 1998, Pages 1037-1046

Impact of self-heating and thermal coupling on analog circuits in SOI CMOS

Author keywords

Analog; CMOS; Self heating; Silicon on insulator; Thermal coupling

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; DIGITAL TO ANALOG CONVERSION; FREQUENCY DOMAIN ANALYSIS; SILICON ON INSULATOR TECHNOLOGY; SWITCHING CIRCUITS; TIME DOMAIN ANALYSIS; TRANSISTORS;

EID: 0032122783     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/4.701253     Document Type: Article
Times cited : (68)

References (18)
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  • 2
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  • 3
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  • 6
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    • Tenbroek, B.M.1    Lee, M.S.L.2    Redman-White, W.3    Bunyan, R.J.T.4    Uren, M.J.5
  • 10
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    • Modelling of thin film SOI devices for circuit simulation including per-instance dynamic self-heating effects
    • Palm Springs, CA, Oct.
    • M. S. L. Lee, W. Redman-White, B. M. Tenbroek, and M. Robinson, "Modelling of thin film SOI devices for circuit simulation including per-instance dynamic self-heating effects," in Proc. IEEE Int. SOI Conference, Palm Springs, CA, Oct. 1993, pp. 150-151.
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  • 16
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  • 17
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.