Stresses during micromolding of metals at elevated temperatures: Pilot experiments and a simple model

Journal of Materials Research

Volumn 20, Issue 1, 2005, Pages 161-175

  Meng, W J ^a   Cao, D M ^a   Sinclair, G B ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; LEAD; SCANNING ELECTRON MICROSCOPY; STRESSES; TEMPERATURE; TENSILE TESTING; YIELD STRESS; ZINC;

MELTING TEMPERATURE; MICROMOLDING;

METAL MOLDING;

EID: 22144437069     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0026     Document Type: Article

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