SCOPUS 정보 검색 플랫폼

Volumn 10, Issue 4, 2004, Pages 323-328

High-temperature instrumented microscale compression molding of Pb

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPRESSIVE STRESS; FRICTION; HIGH TEMPERATURE OPERATIONS; LEAD; LITHOGRAPHY; MOLDING; SCANNING ELECTRON MICROSCOPY; THERMOCOUPLES;

COMPRESSIVE MOLDING; DEMOLDING; HIGH ASPECT RATIO MICROSCALE (HARM) STRUCTURES; X-RAY LITHOGRAPHY;

PLATES (STRUCTURAL COMPONENTS);

EID: 3042597834 PISSN: 09467076 EISSN: None Source Type: Journal
DOI: 10.1007/s00542-003-0333-8 Document Type: Article

Times cited : (21)

References (6)

1
- 0001226667
- Becker EW; Ehrfeld W; Munchmeyer D; Betz H; Heuberger A; Pongratz S; Glashauser W; Michel HJ; Siemens VR (1982) Naturwissenschaften 69: 520
- (1982) Naturwissenschaften , vol.69 , pp. 520
- Becker, E.W.¹ Ehrfeld, W.² Munchmeyer, D.³ Betz, H.⁴ Heuberger, A.⁵ Pongratz, S.⁶ Glashauser, W.⁷ Michel, H.J.⁸ Siemens, V.R.⁹

2
- 3042521105
- Cao DM; Guidry D; Meng WJ; Kelly KW (2003) Microsy Technol
- (2003) Microsy Technol
- Cao, D.M.¹ Guidry, D.² Meng, W.J.³ Kelly, K.W.⁴

3
- 0003689862
- American Society of Metals, Metals Park, Ohio USA
- Massalski TB (ed.) (1986) Binary Alloy Phase Diagrams, American Society of Metals, Metals Park, Ohio USA
- (1986) Binary Alloy Phase Diagrams
- Massalski, T.B.¹

4
- 17144460188
- EE5.23
- Cho HS; Babcock WG; Last H; Hemker KJ (2001) Mat Res Soc Symp Proc 657, EE5.23: 1-6
- (2001) Mat Res Soc Symp Proc , vol.657 , pp. 1-6
- Cho, H.S.¹ Babcock, W.G.² Last, H.³ Hemker, K.J.⁴

5
- 0037439063
- Cho HS; Hemker KJ; Lian K; Goettert J; Dirras G (2003) Sensors and Actuators A103: 59
- (2003) Sensors and Actuators , vol.A103 , pp. 59
- Cho, H.S.¹ Hemker, K.J.² Lian, K.³ Goettert, J.⁴ Dirras, G.⁵

6
- 0035507796
- Cao DM; Wang T; Feng B; Meng WJ; Kelly KW (2001) Thin Solid Films 398/399: 553
- (2001) Thin Solid Films , vol.398-399 , pp. 553
- Cao, D.M.¹ Wang, T.² Feng, B.³ Meng, W.J.⁴ Kelly, K.W.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.