Fracture of Sn-3.5%Ag solder alloy under creep

Journal of Electronic Materials

Volumn 29, Issue 12, 2000, Pages 1356-1361

  Igoshev, V I ^a   Kleiman, J I ^a   Shangguan, D ^b   Wong, S ^b   Michon, U ^c  

^a Integrity Testing Laboratory Inc   (Canada)

^b VISTEON CORPORATION   (United States)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CREEP TESTING; FRACTURE MECHANICS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS;

CRACK NUCLEATION;

TIN ALLOYS;

EID: 0034511246     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0119-z     Document Type: Article

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