Scaling impacts on electromigration in narrow single-damascene Cu interconnects

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 4 A, 2005, Pages 1717-1721

  Yokogawa, Shinji ^a   Tsuchiya, Hideaki ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Drift velocity; Effective incubation time; Electromigration; Linewidth dependence

Indexed keywords

ACTIVATION ENERGY; CURRENT DENSITY; DEGRADATION; ELECTROMIGRATION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); MASS TRANSFER;

DRIFT VELOCITY; EFFECTIVE INCUBATION TIME; LINEWIDTH DEPENDENCE; SCALING IMPACTS;

COPPER;

EID: 21244490452     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.1717     Document Type: Article

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