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Volumn , Issue , 1996, Pages 192-193
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Electromigration failure model of tungsten plug contacts/vias for realistic lifetime prediction
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
ALUMINUM;
APPROXIMATION THEORY;
CALCULATIONS;
COPPER;
ELECTRIC CONTACTS;
ELECTRIC CURRENTS;
FAILURE ANALYSIS;
MATHEMATICAL MODELS;
TEMPERATURE;
VLSI CIRCUITS;
BOLTZMANN CONSTANT;
ELECTROMIGRATION FAILURE MODEL;
STRESS CURRENT;
TUNGSTEN PLUG CONTACTS;
VACANCY CONCENTRATION GRADIENT;
ELECTROMIGRATION;
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EID: 0029698674
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (30)
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References (4)
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