Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing

Journal of Materials Research

Volumn 13, Issue 10, 1998, Pages 2852-2858

  Macionczyk, F ^a   Bruckner W ^a   Pitschke, W ^a   Reiss, G ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; APPROXIMATION THEORY; COPPER COMPOUNDS; CRACK PROPAGATION; ELASTIC MODULI; ELASTICITY; POLYIMIDES; STRAIN; STRESS ANALYSIS; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS;

FORCE-STRAIN CURVES;

CONDUCTIVE FILMS;

EID: 0032186678     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0390     Document Type: Article

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