Mechanical implications of high current densities in flip chip solder joints

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 477-483

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; MECHANICAL ENGINEERING;

ANODE SIDE; ATOMIC FLUXES; CURRENT-STRESSING; DIFFUSIVITIES; EFFECTIVE CHARGE; ELECTROMIGRATION DAMAGE; FLIP CHIP SOLDER JOINTS; HIGH CURRENT DENSITIES; MASS ACCUMULATIONS; NANOINDENTATION TESTS; ROOM TEMPERATURE; SOLDER JOINTS; SURFACE MARKERS; VOID NUCLEATION;

ELECTROMIGRATION;

EID: 78249275229     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-33650     Document Type: Conference Paper

References (10)

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