Self-Aligned Deposition Process for Ultrathin Electroless Barriers and Copper Films on Low-k Dielectric Films

Electrochemical and Solid-State Letters

Volumn 7, Issue 2, 2004, Pages

  Chen, G S ^a   Chen, S T ^a   Louh, R F ^a   Yang, T J ^a   Lin, C K ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION SPECTROSCOPY; ATOMIC FORCE MICROSCOPY; CATALYSIS; COPOLYMERS; COPPER; ELECTROLESS PLATING; GRAFTING (CHEMICAL); HYDROGEN PEROXIDE; INTERFACES (MATERIALS); METALLIZING; PLASMAS; PRECIPITATION (CHEMICAL); THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS BARRIERS; INTERCONNECT METALS;

DIELECTRIC FILMS;

EID: 1842484007     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1634105     Document Type: Article

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