Multilayer TiC/TiN diffusion barrier films for copper

Applied Physics Letters

Volumn 80, Issue 1, 2002, Pages 79-81

  Yoganand, S N ^a   Raghuveer, M S ^a   Jagannadham, K ^a   Wu, L ^a   Karoui, A ^a   Rozgonyi, G ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION BARRIER FILMS; POLYCRYSTALLINE; REACTIVE MAGNETRON SPUTTERING; SI (100) SUBSTRATE; SI SUBSTRATES; SUBSTRATE TEMPERATURE; TIN THIN FILMS;

COPPER; DEEP LEVEL TRANSIENT SPECTROSCOPY; DIFFUSION BARRIERS; FILM PREPARATION; MULTILAYERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SUBSTRATES; TITANIUM CARBIDE; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

MULTILAYER FILMS;

EID: 79955988332     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1430027     Document Type: Article

References (14)

1. J. Hems, Semicond. Int. 11, 100 (1990). sit SITLDD 0163-3767
2. J. D. Plummer, M. Deal, and P. B. Griffin, Silicon VLSI Technology, Fundamentals, Practice, and Modeling, 1st ed. (Prentice-Hall, Upper Saddle River, NJ, 2000), pp. 696-698.
3. R. Wuhrer, W. Y. Yeung, M. R. Philips, and G. McCredie, Thin Solid Films 290-291, 339 (1996). tsf THSFAP 0040-6090
4. M. Moriyama, T. Kawazoe, M. Tanaka, and M. Murakami, Material Research Society Conference Proceedings, ULSI XV, 2000, pp. 277-281.
5. T. Shikama, M. Fukutomi, M. Fujitsuka, and M. Okada, J. Nucl. Mater. 122/123, 1281 (1984). jnu JNUMAM 0022-3115
6. M. Shmsuzzoha and A. Kumar, in Hard Coatings on Borides, Carbides, & Nitrides, edited by A. Kumar, Y. W. Chung, and R. W. J. Chia (The Minerals, Metals, & Materials Society, Warrendale, PA, 1998), pp. 249-257.
7. M. Eizenberg, S. P. Murarka, and P. A. Heimann, J. Appl. Phys. 54, 3195 (1983). jap JAPIAU 0021-8979
8. S.-Q. Wang, MRS Bull. 19, 30 (1994). mbu MRSBEA 0883-7694
9. S. S. Wong, C. Ryu, H. Lee, and K. W. Kwon, Mater. Res. Soc. Symp. Proc. 514, 75 (1998). mrs MRSPDH 0272-9172
10. J. Baumann, T. Werner, A. Ehrlich, M. Rennau, Ch. Kaufmann, and T. Gessner, Microelectron. Eng. 37/38, 221 (1997). mie MIENEF 0167-9317
11. T Oku, H Mori, and M Murakami, Proc. IEEE, 5th Int. Conf. Solid State and Integrated Circut Technology, Beijing (IEEE, Piscataway, 1998), pp. 238-241.
12. R. G Gordon, X. Liu, R. N. R. Broomhall-Dillard, and Y. Shi, Mater. Res. Soc. Symp. Proc. 564, 335 (1999). mrs MRSPDH 0272-9172
13. T. Shikama, H. Shinno, M. Fukutomi, M. Fujitsuka, M. Kitajima, and M. Okada, Thin Solid Films 101, 233 (1983). tsf THSFAP 0040-6090
14. J. E. Sundgren, B. O. Johansson, and S. E. Karlsson, Thin Solid Films 105, 353 (1983). tsf THSFAP 0040-6090