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Volumn 15, Issue 4, 2005, Pages 764-770

Macroporous silicon-based deep anisotropic etching

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ASPECT RATIO; CRYSTAL ORIENTATION; ELECTRIC CONDUCTIVITY; ELECTRIC SPACE CHARGE; ELECTROLYTES; MICROMACHINING; POROUS MATERIALS; SILICON; SILICON WAFERS;

EID: 17444403586     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/4/013     Document Type: Article
Times cited : (15)

References (19)
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    • Deep trench fabrication by Si (110) orientation dependent etching
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  • 7
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  • 8
    • 0030156411 scopus 로고    scopus 로고
    • Precise mask alignment to the crystallographic orientation of silicon wafers using wet anisotropic etching
    • Vangbo M and Backlund Y 1996 Precise mask alignment to the crystallographic orientation of silicon wafers using wet anisotropic etching J. Micromech. Microeng. 6 279-84
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  • 11
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    • Ottow, S.1    Lehmann, V.2    Foil, H.3
  • 12
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    • Lehmann V and Foil H 1990 Formation mechanism and properties of electrochemically etched trenches in n-type silicon J. Electrochem. Soc. 137 653-9
    • (1990) J. Electrochem. Soc. , vol.137 , pp. 653-659
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  • 13
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    • Local formation of macroporous silicon through a mask
    • Tao Y and Esashi M 2004 Local formation of macroporous silicon through a mask J. Micromech. Microeng. 14 1411-5
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  • 14
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.