Measurement of nanodisplacements and elastic properties of MEMS via the microscopic hole method

Sensors and Actuators, A: Physical

Volumn 120, Issue 1, 2005, Pages 163-171

  Cho, Sungwoo ^a   Cárdenas García, Jaime F ^b   Chasiotis, Ioannis ^a  

^a University of Virginia   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Inverse problem; Material properties; MEMS; Microscopic hole method; Nanometric displacements; Polycrystalline silicon; Thin films

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELASTIC MODULI; ELASTICITY; INVERSE PROBLEMS; POLYSILICON; TENSILE STRESS; THIN FILMS;

MATERIAL PROPERTIES; MEMS; MICROSCOPIC HOLE METHOD; NANOMETRIC DISPLACEMENTS;

MICROELECTROMECHANICAL DEVICES;

EID: 17444387973     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.11.028     Document Type: Article

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