Freestanding three-dimensional copper foils prepared by electroless deposition on micropatterned gels

Advanced Materials

Volumn 17, Issue 6, 2005, Pages 751-755

  Smoukov, Stoyan K ^a   Bishop, Kyle J M ^a   Campbell, Christopher J ^a   Grzybowski, Bartosz A ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROFORMING; ELECTROLESS PLATING; EVAPORATION; GELS; METALLIC FILMS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROSTRUCTURE; PARTIAL DIFFERENTIAL EQUATIONS; ROBOTS; SURFACE ROUGHNESS; SURFACE TOPOGRAPHY;

COPPER FOILS; MICROROBOTS; MICROWAVEGUIDES; THERMAL EVAPORATION;

METAL FOIL;

EID: 15744402974     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200401010     Document Type: Article

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