New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 124-129

  Koike, Shinji ^a   Shimokawa, Fusao ^a   Matsuura, Tohru ^a   Takahara, Hideyuki ^a  

^a NTT CORPORATION   (Japan)

Author keywords

Fluorinated polyimide optical waveguide; Guiding groove; Mirror; Solder bumps; Total internal reflection mirror

Indexed keywords

BONDING; COPPER; ELECTRONICS PACKAGING; HEAT TREATMENT; MIRRORS; MULTICHIP MODULES; MULTILAYERS; OPTOELECTRONIC DEVICES; PHOTODIODES; POLYIMIDES; SOLDERING; SUBSTRATES;

ELECTRICAL HYBRID PACKAGING TECHNIQUE; FLUORINATED POLYIMIDE OPTICAL WAVEGUIDES; GUIDING GROOVE; OPTICAL HYBRID PACKAGING TECHNIQUE; OPTICAL TRANSPARENCY; OPTOELECTRONIC MULTICHIP MODULE; PHOTOLITHOGRAPHIC PATTERNING; SPINCOATING; TOTAL INTERNAL REFLECTIONS;

OPTICAL WAVEGUIDES;

EID: 0030082167     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486494     Document Type: Article

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