Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Journal of Micromechanics and Microengineering

Volumn 15, Issue 3, 2005, Pages 535-542

  Wu, Mingching ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FABRICATION; MICROACTUATORS; MICROMACHINING; OPTOELECTRONIC DEVICES; POLYSILICON; STIFFNESS; SYSTEMS ANALYSIS; THIN FILMS;

MICRO-OPTO-ELECTRO-MECHANICAL SYSTEMS (MOEMS); OPTICAL SCANNER; PLANAR MICROMACHINING FABRICATION PROCESSES; THIN-FILM MATERIALS;

MICROELECTROMECHANICAL DEVICES;

EID: 15544376517     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/3/014     Document Type: Article

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